Florian Solzbacher - Publications

Selected Book Chapters and Sections

• F. Solzbacher
  Microsystems Technology - a New Era Leading to Unequalled Potentials for Automotive Applications
  Advanced Microsystems for Automotive Applications 2002 pp. 31-34,
  Springer Verlag 2002
• F. Solzbacher
  Fabrication Technologies for 3D-microsensor structures
  Advanced Microsystems for Automotive Applications 2002, pp. 35-39,
  Springer Verlag 2002
• F. Solzbacher (Coordinator/Co-Editor)
  Technology section (processes, principle applications, signal processing, packaging, materials)
  Advanced Microsystems for Automotive Applications 2002, pp. 1-81,
  Springer Verlag 2002
• F. Solzbacher (Coordinator/Co-Editor)
  Technologies and Materials section
  Advanced Microsystems for Automotive Applications 2003, pp. 1-81,
  Springer Verlag 2003
• F. Solzbacher
  Physical Vapor Deposition (Chapter 12)
  Semiconductor Manufacturing Handbook (M.h. Geng, Ed.),
  McGraw-Hill, 2005

Selected Journal Articles
and Conference Abstracts

• F. Solzbacher, D. Mutschall, E. Obermeier
  Au-Modified NiO Thinfilms for Applications in H2S-Gassensors
  Sensor '99 - 9th Int'l Trade Fair and Conference for Sensors / Transducers & Systems, Nürnberg, Germany, May 18-20, 1999.
  Sensor '99 Proceedings I, 1999, B 3.2, pp. 165-169
• C. Imawan, F. Solzbacher, H. Steffes, E. Obermeier
  Improvement of gas sensing properties of MoO3 thin films using Ti - Overlayers for the application in NH3 gas sensors
  Transducers '99 - 10th International Conference on Solid-State Sensors & Actuators, Sendai, Japan, June 7-10
  Digest of Technical Papers, 1999, pp. 1686 - 1689
• F. Solzbacher, C. Imawan, H. Steffes, E. Obermeier
  A new low power SiC / HfB2 - based microhotplate with integrated IDC for metal oxide gassensors
  Transducers '99 - 10th International Conference on Solid-State Sensors & Actuators, Sendai, Japan, June 7-10
  Digest of Technical Papers, 1999, pp. 1032 - 1035
• H. Steffes, C. Imawan, F. Solzbacher, E. Obermeier
  Reactively RF-Sputtered In2O3 Thin Films for the Detection of NO2
  Eurosensors XIII, The Hague, The Netherlands, September 12-15, 1999,
  Proceedings, pp. 871 - 874
• C. Imawan, F. Solzbacher, H. Steffes, E. Obermeier
  Modified NiO thin films using Ti-overlayers for H2 sensing
  Eurosensors XIII, The Hague, The Netherlands, September 12-15, 1999,
  Proceedings, pp. 137 - 140
• H. Steffes, C. Imawan, F. Solzbacher, E. Obermeier
  Ti and Au surface modifications of In2O3 thin films for NO2 sensing
  Eurosensors XIV, August 27-30, 2000, Copenhagen, Denmark,
  Proceedings, pp. 141-144
• H. Steffes, P. Fricke, R. Schneider, C. Imawan, F. Solzbacher, E. Obermeier
  New gas sensitive thin films based on In2O3 Presented at IMCS 2000, July 2-5, 2000, Basel, Switzerland
• F. Solzbacher, C. Imawan, H. Steffes, E. Obermeier
  A new SiC/HfB2 based low power NO2-sensor Presented at IMCS 2000, July 2-5, 2000, Basel, Switzerland
• F. Solzbacher, C. Imawan, H. Steffes, E. Obermeier
  A highly stable SiC based micro hotplate NO2 gas sensor
  Eurosensors XIV, August 27-30, 2000, Copenhagen, Denmark,
  Proceedings, pp. 931-932
• H. Steffes, C. Imawan, F. Solzbacher, E. Obermeier
  Fabrication parameters and NO2 sensitivity of reactively RF-sputtered In2O3 thin films
  Sensors and Actuators, B 68, 2000, pp. 249 - 253
• F. Solzbacher, C. Imawan, H. Steffes, E. Obermeier, H. Möller
  A modular system of SiC-based microhotplates for the application in metal oxide gas sensors Sensors and Actuators, B 64, 2000, pp. 95 - 101
• C. Imawan, F. Solzbacher, H. Steffes, E. Obermeier Gas sensing characteristics of modified MoO3 thin films using Ti-overlayers for NH3 gas sensors
  Sensors & Actuators B 64, 2000, pp. 193 - 197
• C. Imawan, F. Solzbacher, H. Steffes, E. Obermeier
  TiOx-modified NiO thin films for H2 gas sensors: Effects of TiOx-overlayer sputtering parameters
  Sensors & Actuators B 68, 2000, pp. 184 - 188
• C. Imawan, H. Steffes, F. Solzbacher, E. Obermeier
  Sputtered MoO3 multilayer thin films for H2 detection
  Eurosensors XIV, August 27-30, 2000, Copenhagen, Denmark,
  Proceedings, pp. 155 - 158

• C. Imawan, H. Steffes, F. Solzbacher, E. Obermeier
  Sputtered V/MoO3 thin films for highly sensitive and selective H2 detection
  Presented at IMCS 2000, July 2-5, 2000, Basel, Switzerland
• H. Steffes, C. Imawan, P. Fricke, H. Vöhse, J. Albrecht, R. Schneider, F. Solzbacher, E. Obermeier
  New InxOyNz films for application in NO2 sensors
  Sensors and Actuators, B 77, 2001, pp. 352 - 358
• F. Solzbacher, C. Imawan, H. Steffes, E. Obermeier, M. Eickhoff
  A new SiC/HfB2 based low power NO2-sensor
  Sensors and Actuators, B 77, 2001, pp. 111-115
• H. Steffes, C. Imawan, F. Solzbacher, E. Obermeier Enhancement of NO2 sensing properties of In2O3-based thin films using an Au or Ti surface modification
  Sensors and Actuators, B 78, 2001, pp. 106 - 112
• F. Solzbacher, C. Imawan, H. Steffes, E. Obermeier, M. Eickhoff
  A highly stable SiC based micro hotplate NO2 gas sensor
  Sensors and Actuator, B 78, (2001), pp. 216-220
• C. Imawan, H. Steffes, F. Solzbacher, E. Obermeier
  Structural and gas-sensing properties of V2O5-MoO3 thin films for H2 detection
  Sensors and Actuators, B 77, 2001, pp. 346 - 351
• C. Imawan, H. Steffes, F. Solzbacher, E. Obermeier
  A new preparation method for sputtered MoO3 multilayers for the application in gas sensors
  Sensors and Actuators, B 78, 2001, pp. 119 - 125
• F. Solzbacher, J,-Y. Lindheimer
  High Temperature Pressure Sensors - Potentials for new Concepts in Automotive Applications
  Advanced Microsystems for Automotive Applications 2001, pp. 253-265, Springer Verlag 2001
• F. Solzbacher
  SOI - new dimensions for microproducts: markets - materials - microsystems
  mstnews 1/2001, pp.41-42
• F. Solzbacher
  Microsystems Technology - a New Era Leading to Unequalled Potentials for Automotive Applications
  Advanced Microsystems for Automotive Applications 2002 pp. 31-34, Springer Verlag 2002.
• F. Solzbacher
  Fabrication Technologies for 3D-microsensor structures
  Advanced Microsystems for Automotive Applications 2002 pp.35-39, Springer Verlag 2002.
• F. Solzbacher (Coordinator/Co-Editor),
  Technology section (processes, principle applications, signal processing, packaging, materials)
  Advanced Microsystems for Automotive Applications 2002, pp.1-81, Springer-Verlag 2002.
• F. Solzbacher (Coordinator/Co-Editor),
  Technologies and Materials section
  Advanced Microsystems for Automotive Applications 2003, pp.1-81, Springer-Verlag 2003.
• F. Solzbacher, S. Krüger
  Microsystems - where are we heading, lead article, mstnews 1/2003, pp.6 10, 2003.
• F. Solzbacher, S. Bütefisch
  Cutting edge silicon-based micro machined sensors for next generation household appliance
  Sensors in Household Appliances, pp.198-210, Sensors in Household Appliances, Wiley VCH, 2003

• S. Bütefisch, F. Solzbacher, R. Ziermann, P. Krause, S. Büttgenbach, R. Wilke, S. Cao, P. Pornnoppadol, U. Brand, K. Seitz, R. Roth,
  New Micro Probe for Dimensional Metrology based on a Silicon Microstructure
  Proc. Sensor 2003, pp. 75 - 80, 2003
• F. Solzbacher, T. Doll, E. Obermeier,
  A Comprehensive Analytical and Numerical Analysis of Transient and Static Micro Hotplate Characteristics
  Transducers'03, the 12th international conference on solid-state sensors, actuators and Microsystems, June 8-12, Boston, MA, USA, 2003
• S. Bütefisch, F. Solzbacher, R. Ziermann, P. Krause, S. Büttgenbach, R. Wilke, S. Cao, P. Pornnoppadol, U. Brand, K. Seitz, R. Roth,
  Mikrotaster für Anwendungen in der taktilen Wegmesstechnik
  Technisches Messen 70, S. 238 - 243, 2003 PTB
• M. Grosse Holthaus, S. Kammer, M. Hanauer, K.P. Koch, K.-P. Hoffmann, Investigations of Adhesion and Encapsulation Properties on Hybrid Cuff Electrodes used Materials in in Vitro Experiments 39 Jahrestagung der Deutschen Gesellschaft für Biomedizinische Technik, Biomedizinische Technik, Bd. 50, Ergängungsband 1, pp. 1563 - 1564, 2005
• F. Solzbacher, R. Harrison, R. Normann, H. Oppermann, M. Klein, K.P. Koch, S. Kammer, A. Ramachandran, S. Kim, Integrated neural interface arrays for neuroprosthetics applications 1st Annual Meeting of American Academy of Nanomedicine, Aug 15-16, 2005
• J.-M. Hsu, L. Rieth, S. Kammer, K.P. Koch, R.A. Normann, F. Solzbacher, PECVD a-SiC:H and Parylene encapsulation for chronically implanted neural recording devices NIH/NINDS Neural Interfaces Workshop, Bethesda, MD, Sep 7-9, 2005
• L. Rieth, S. Chakravarty, J.-M. Hsu, R. Normann, F. Solzbacher, M. Klein, M. Töpper, S. Kim, Switchable LTCC/Polyimide Based Thin Film Coils NIH/NINDS Neural Interfaces Workshop, Bethesda, MD, Sep 7-9, 2005
• L. Rieth, K. Hofeling, S. Chakravarty, K.-F. Becker, J.-M. Hsu, R.A. Normann, R. Harrison, F. Solzbacher, M. Klein, H. Oppermann, A biocompatible flip chip bonding process for neural interface system integration NIH/NINDS Neural Interfaces Workshop, Bethesda, MD, Sep 7-9, 2005
• L. Rieth, S. Chakravarty, J.-M. Hsu, R.A. Normann, R. Harrison, F. Solzbacher, M. Klein, and H. Oppermann, A biocompatible flip-chip bonding process for neural interface system integration NIH/NINDS Annual Neural Interfaces Workshop, Bethesda, MD, 2005.
• F. Solzbacher, R. Harrison. R.A. Normann, L. Rieth, S. Chakravarty, J.-M. Hsu, M. Klein, H. Oppermann, M. Toepper, and R. Hahn, A next generation chronically implantable wireless neural interface NIH/NINDS Annual Neural Interfaces Workshop, Bethesda, MD, 2005 (invited paper).
• D.J. Black, P.T. Watkins, R.J. Kier, R.O. Lovejoy, R. Normann, F. Solzbacher, and R.R. Harrison, Power and command transfer in a wireless 100-electrode neural recording system 1st Annual Mountain West Biomedical Engineering Conference, Snowbird, UT, 2005.
• R.J. Kier, P.T. Watkins, D.J. Black, R.O. Lovejoy, R. Normann, F. Solzbacher, and R.R. Harrison, A low-power 433 MHz transmitter for an implantable neural recording system 1st Annual Mountain West Biomedical Engineering Conference, Snowbird, UT, 2005
• P.T. Watkins, R.J. Kier, R.O. Lovejoy, D.J. Black, R. Normann, F. Solzbacher, and R.R. Harrison, Signal amplification, detection, and digitization in a wireless 100-electrode neural recording system 1st Annual Mountain West Biomedical Engineering Conference, Snowbird, UT, 2005
• R.R. Harrison, P.T. Watkins, R.J. Kier, R.O. Lovejoy, D.J. Black, F. Solzbacher, and R.A. Normann, A low-power microchip for a wireless 100-electrode neural recording system 35th Annual Meeting of the Society for Neuroscience, Washington, DC, 2005.
• R.R. Harrison, P.T. Watkins, R.J. Kier, R.O. Lovejoy, D.J. Black, R.A. Normann, and F. Solzbacher, A low-power integrated circuit for a wireless 100-electrode neural recording system Proceedings of 2006 IEEE International Solid-State Circuits Conference (ISSCC 2006), pp. 554-555, 672, San Francisco, CA, 2006 (Invited paper)
• S. Kim, K. Buschick, K. Zoschke, M. Klein, M. Toepper, D. Black, R. Harrison, P. Tathireddy, F. Solzbacher, Polymer based thin film coils as a power module of wireless neural interfaces Proceedings of the IEEE Workshop on Microelectronics and Electron Devices (WMED), Boise, ID, April 14, 2006
• S. Kim, O. Scholz, K. Zoschke, R. Harrison, F. Solzbacher, M. Klein, M. Toepper, FEA Simulation of Thin Film Coils to Power Wireless Neural Interfaces Proceedings of 2006 NSTI Nanotechnology Conference and Trade Show (Nanotech 2006), Boston, MA, May 7-11, 2006
• P. Tathireddy, S. Chakravarty, L. Rieth, R.A. Normann, R. Harrison, F. Solzbacher, M. Klein and H. Oppermann, Biocompatible Hybrid System Integration of Silicon Based Neural Interface Device Proceedings of 2006 NSTI Nanotechnology Conference and Trade Show (Nanotech 2006), Boston, MA, May 7-11, 2006
• M. Töpper, M. Klein, K. Buschick, V. Glaw, K. Orth, O. Ehrmann, M. Hutter, H. Oppermann, K.-F. Becker, T. Braun, F. Ebling, H. Reichl, S. Kim, P. Tathireddy, S. Chakravarty, F. Solzbacher, Biocompatible Hybrid Flip Chip Microsystem Integration for Next Generation Wireless Neural Interfaces Proceedings of the 55th Electronic Components and Technology Conference (ECTC), San Diego, CA, May 30-June 2, 2006
• M. Töpper, L. Dietrich, K. Orth, O. Ehrmann, S. Kim, M. Klein, R. Harrison, P. Tathireddy, F. Solzbacher, H. Reichl, Wafer Level Packaging based on Electroplating for Medical Implantable Devices PEAKS Conference on Electrochemical Processing for Microelectronics, Whitefish, MT, June 20-23, 2006
• Kammer, Sascha; große Holthaus, Marzellus; Hsu, Jui-Mei; Koch, Klaus Peter; Solzbacher, Florian, Implementation of methods to characterise encapsulation behaviour of intended implantable materials 1st Electronics Systemintegration Technology Conference (ESTC 2006), Dresden, Germany, September 5-7, 2006
• S. Kim, R.A. Normann, R. Harrison, F. Solzbacher, Preliminary Study of Thermal Impacts of the Microelectrodes Array Implanted in the Brain 28th Annual International Conference of the IEEE EMBS, New York City, NY, Aug 30-Sep 3, 2006
• P. Tathireddy, J.-M. Hsu, L. Rieth, S. Kammer, K.P. Koch, R.A. Normann, F. Solzbacher, PECVD a-SiC:H encapsulation for chronically implanted neural recording devices Materials Research Society (MRS) Spring Meeting, San Francisco, CA, April 17-21, 2006
• Hsu, Jui-Mei; Tathireddy, Prashant; Rieth, Loren; Vanfleet, Richard; Kammer, Sascha; Koch, Klaus Peter; Normann, A. Richard; Solzbacher, Florian, Characterizations of a-SiCx:H film as encapsulation material for integrated silicon base neural interface devices to be submitted to Thin Solid Film
• S. Kim, K. Buschick, K. Zoschke, D. Black, M. Klein, M. Toepper, R. Harrison, P. Tathireddy, F. Solzbacher, Switchable polymer based thin film coils as a power module of wireless neural interfaces to be submitted to Sensors and Actuators A
• S. Kim, M. Töpper, M. Klein, K. Buschick, V. Glaw, K. Orth, P. Tathireddy, S. Chakravarty, F. Solzbacher, O. Ehrmann, H. Reichl, Biocompatible Hybrid Flip Chip Microsystem Integration for Next Generation Wireless Neural Interfaces in preparation